Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/27299
Title: Experimental study of optimum spacing problem in the cooling of simulated electronic package
Authors: Chen, S
Liu, Y 
Chan, SF
Leung, CW 
Chan, TL 
Issue Date: 2001
Publisher: Springer
Source: Heat and mass transfer, 2001, v. 37, no. 2-3, p. 251-257 How to cite?
Journal: Heat and mass transfer 
Abstract: An experimental investigation has been performed to determine the effects of different arrangements of obstacles on the cooling of simulated electronic package. The considered simulated electronic package consisted of a channel formed by two parallel plates. The bottom plate is attached with five identical electrically heated square obstacles, which are perpendicular to the mean airflow and arranged with different side-to-side distances. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option and should be avoided. A better thermal performance could be obtained when the side-to-side distances between the obstacles followed a geometric series. For example, at Re = 800, the highest temperature of the optimum arrangement could be reduced by 12% compare to the equi-spaced arrangement and the maximum temperature difference among the five obstacles is lower than that of equi-spaced arrangement by 32.1%.
URI: http://hdl.handle.net/10397/27299
ISSN: 0947-7411
EISSN: 1432-1181
DOI: 10.1007/s002310000168
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