Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/26749
Title: A study of microvias produced by laser-assisted seeding mechanism in blind via hole plating of printed circuit board
Authors: Leung, ESW
Yung, WKC 
Lee, WB 
Keywords: Laser-assisted seeding
Microvia
Printed circuit board
Issue Date: 2004
Publisher: Springer
Source: International journal of advanced manufacturing technology, 2004, v. 24, no. 7-8, p. 474-484 How to cite?
Journal: International journal of advanced manufacturing technology 
Abstract: The laser-assisted seeding (LAS) mechanism has the potential to replace the conventional electroless copper plating in printed circuit board (PCB) manufacture because it combines the steps of drilling and electroless plating into one. The LAS mechanism should be able to plate microvias with high aspect ratio that may not be feasible by conventional electroless plating due to the small via geometry. The conventional electroless plating process generates considerable quantities of chemical waste. In particular, the plating of microvia with high aspect ratio close to 1 is difficult due to the limited accessibility of chemical solution to the via internal wall surface in conventional plating technology. LAS is a promising alternative. The objectives of this paper are to report the deposition mechanism of a thin copper film layer (laser-assisted seeding) on PCB microvias dielectric and to study the thermal reliability of the microvias produced by this mechanism. Results find that the microvias produced by LAS are thermally and electrically as reliable as conventional electroless plating technology.
URI: http://hdl.handle.net/10397/26749
ISSN: 0268-3768
EISSN: 1433-3015
DOI: 10.1007/s00170-003-1583-4
Appears in Collections:Journal/Magazine Article

Access
View full-text via PolyU eLinks SFX Query
Show full item record

SCOPUSTM   
Citations

7
Last Week
0
Last month
0
Citations as of Oct 8, 2017

WEB OF SCIENCETM
Citations

5
Last Week
0
Last month
0
Citations as of Oct 15, 2017

Page view(s)

47
Last Week
0
Last month
Checked on Oct 15, 2017

Google ScholarTM

Check

Altmetric



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.