Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/2536
Title: Polypyrrole-coated fabric strain sensor with high sensitivity and good stability
Authors: Cheng, X
Li, Y
Tao, X 
Tsang, HYJ
Leung, MY
Xue, P
Cheng, X
Yuen, CWM
Keywords: Fabric strain sensor
Polypyrrole
Stability
Issue Date: 2006
Publisher: IEEE
Source: IEEE-NEMS : the proceedings of the 1st International Conference on Nano/Micro Engineered and Molecular Systems : January 18-21, 2006, Zhuhai, China, p. 1245-1249 How to cite?
Abstract: The sensitivity and stability are mainly factors to hold back the practical applications of Polypyrrole coated fabrics. In this paper, a flexible fabric strain sensor with high sensitivity, good stability and large deformation is reported. It is fabricated by depositing a nano-layer (200nm to 300nm) of polypyrrole on the fabric substrate at low temperature. Thickness and morphology of the conducting thin film on the surface of the fibers were examined by scanning probe microscopy (SPM) and scanning electron microscopy (SEM). The measurement of the conductivity change with strain shows the fabrics so prepared exhibits a high strain sensitivity of ~160 for a deformation as large as 50%, while its good stability is indicated by a small loss of conductivity after the thermal and humidity aging tests, and supported by the slight change in conductivity and sensitivity over a storage of eighteen months. The flexible strain sensor is expected to be a promising "soft" smart material with good sensing properties in the preparation of smart garment, wearable hardware and biomedical applications.
URI: http://hdl.handle.net/10397/2536
ISBN: 1424401402
DOI: 10.1109/NEMS.2006.334708
Rights: © 2006 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
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