Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/24737
Title: Process design for transfer moulding of electronic packages using a case-based reasoning approach with fuzzy regression adaptation
Authors: Tong, KW
Kwong, CK 
Chan, CY 
Issue Date: 2005
Publisher: Taylor & Francis
Source: International journal of computer integrated manufacturing, 2005, v. 18, no. 1, p. 27-40 How to cite?
Journal: International journal of computer integrated manufacturing 
Abstract: Process design of transfer moulding for electronic packages involves the determination of mould design parameter settings and process parameter settings that are calculated manually on a trial-and-error basis under the current practice. The effectiveness of the parameter settings is largely dependent on the experience of the engineers. In this paper, a process design for the transfer moulding of electronic packages using case-based reasoning (CBR) with fuzzy regression adaptation is described by which a CBR system for the process design of transfer moulding for electronic packages, named as CBR-TM, was developed to determine the initial mould design parameters and process parameter settings. In the design and development of the CBR-TM, fuzzy set theory was introduced in the case retrieval to improve the quality of retrieved cases. Additionally, a novel adaptation technique based on fuzzy regression was proposed to improve the accuracy of adapted solutions. Implementation of the CBR-TM has demonstrated that the time required for determination of proper initial mould design parameters and process parameter settings can be greatly reduced based on utilization of the proposed approach.
URI: http://hdl.handle.net/10397/24737
ISSN: 0951-192X
EISSN: 1362-3052
DOI: 10.1080/09511920412331284771
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