Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/23823
Title: Effect of tool drop on the performance of a high-frequency piezoelectric wire-bonding transducer system
Authors: Or, SW 
Chan, HLW 
Cheng, KC
Cheung, YM
Yuen, CW
Liu, PCK
Keywords: Bonding tool
High-frequency wire bonding
Ultrasonic transducer
Issue Date: 1999
Publisher: Taylor & Francis Inc.
Source: Ferroelectrics, 1999, v. 232, no. 1-4, p. 217-222 How to cite?
Journal: Ferroelectrics 
Abstract: This work describes a method to determine a suitable tool drop for clamping the bonding tool in a high-frequency (130 kHz) piezoelectric horn transducer used for wire bonding. Effect of different tool drops on four critical parameters, namely, the resonant frequency, the electrical impedance, the phase angle, and the tool tip displacement amplitude, were studied with the transducer system being driven at normal bonding power. Strong interdependence was observed among these parameters. The results were interpreted from the system stability and other physical point of views. Appropriate ranges of tool drop were found. With the tool drop in these ranges, it can produce desirable characteristics for the wire bonding.
URI: http://hdl.handle.net/10397/23823
ISSN: 0015-0193
EISSN: 1563-5112
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