Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/23736
Title: Size effect of AlN on the performance of Printed Circuit Board (PCB) material-brominated epoxy resin
Authors: Yung, KC 
Wu, J
Yue, TM 
Xie, CS
Keywords: AlN
Brominated epoxy resin
Coefficient of thermal expansion (CTE)
Dielectric constant (Dk)
Dissipation factor (Df)
Tensile strength
Young's modulus
Issue Date: 2006
Publisher: Sage Publications Ltd
Source: Journal of composite materials, 2006, v. 40, no. 7, p. 567-581 How to cite?
Journal: Journal of Composite Materials 
Abstract: Many properties of brominated epoxy resin, a type of material widely used in printed circuit boards (PCBs), such as the coefficient of thermal expansion (CTE) (pre and post T g), dielectric constant (D k), dissipation factor (D f), tensile strength, and Young's modulus, have been evaluated according to size and content in terms of the weight of the aluminum nitride (AlN) filler. It has been found that the performance of epoxy resin improves significantly when AlN is used as the filler. Excellent properties were obtained when 2.3 mm AlN was added till 50 wt%; i.e., CTE (pre T g) 1/4 27 ppm/C, T g 1/4 128 C, D f 1/4 0.016, D k 1/4 7.5, and Young's modulus 1/4 7.5 GPa. The SEM results show that the dispersion of AlN nanopowder filler is largely homogeneous.
URI: http://hdl.handle.net/10397/23736
ISSN: 0021-9983
DOI: 10.1177/0021998305055271
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