Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/23637
Title: Fabrication of polymer silver conductor using inkjet printing and low temperature sintering process
Authors: Wu, SP
Yung, KC 
Xu, LH
Ding, XH
Keywords: Conductor
Inkjet printing
Microstructure
Polymer
Submicrometer metallic powders
Issue Date: 2008
Publisher: Institute of Electrical and Electronics Engineers
Source: IEEE transactions on electronics packaging manufacturing, 2008, v. 31, no. 4, p. 291-296 How to cite?
Journal: IEEE transactions on electronics packaging manufacturing 
Abstract: In this paper, silver powders with a uniform particle size of 0.2-0.4 μm and an excellent dispersibility were applied to produce a conductive ink for the inkjet printing process. The thermal behaviors of silver particles sintered at different temperature were investigated through X-ray diffraction (XRD) patterns. It was found out that both the particle size and crystal grains increase during the surface diffusion and sintering process. A drop-on-demand (DOD) inkjet printing system was employed to print the conductor by using as-mentioned silver particles suspended in terpineol/polyketone (PK) system as conductive materials. The optimized value of W PK/W silver was 5%, corresponding to a resistivity of 2.0 μΩ · cm. It was revealed that an increase in the W PK/W silver ratio resulted in the increase in both the resisitivity and adhesion strength of the conductor. The scanning electron microscopy (SEM) analysis based on the microstructures of silver conductor further illustrates that the densification of conductor and long-range interparticle connectivity ensure the silver conductor a low resistivity. The adhesiveness effect from PK resin enables the conductor a high adhesion strength.
URI: http://hdl.handle.net/10397/23637
ISSN: 1521-334X
EISSN: 1558-0822
DOI: 10.1109/TEPM.2008.2004554
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