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Title: Sensors for ultrasonic wire bonding process control
Authors: Chiu, SS
Chan, HLW 
Or, SW 
Cheung, YM
Yuen, CW
Liu, PCK
Keywords: Piezoelectric sensors
Strain gauge
Ultrasonic transducer
Wire bonding
Issue Date: 1999
Publisher: Taylor & Francis Inc.
Source: Ferroelectrics, 1999, v. 232, no. 1-4, p. 211-216 How to cite?
Journal: Ferroelectrics 
Abstract: Ultrasonic wire bonding is an important technique in microelectronics packaging, as it provides electrical connections between an integrated circuit (IC) and the chip carrier. As the bond quality can vary appreciably, it is important to develop some in-process monitoring method to improve the reliability and quality of bonding. In this work, a piezoelectric lead zirconate titanate (PZT) sensor was used to measure two critical parameters. They are: (1) the temporal profiles of ultrasonic power and (2) the impact force imparted to the bonding pad by the bonding tool. A calibrated wire strain gauge was also used to measure the impact dynamic force and the static force applied to the bond surface. This is compared to that of the PZT sensor.
ISSN: 0015-0193
EISSN: 1563-5112
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