Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/23184
Title: Size control and characterization of Sn-Ag-Cu lead-free nanosolders by a chemical reduction process
Authors: Yung, KC 
Law, CMT
Lee, CP
Cheung, B
Yue, TM 
Keywords: chemical reduction
Lead-free
melting temperature
nanosolders
Sn-3.0Ag-0.5Cu
Issue Date: 2012
Publisher: Springer
Source: Journal of electronic materials, 2012, v. 41, no. 2, p. 313-321 How to cite?
Journal: Journal of Electronic Materials 
Abstract: Sn-3.0Ag-0.5Cu nanosolders were synthesized via a chemical reduction method. Polyvinyl pyrrolidone (PVP) and sodium borohydride (NaBH 4) were employed as surfactant and reducing agent, respectively. Ultraviolet-visible (UV-visible) absorption and x-ray diffraction patterns revealed that alloying had successfully taken place during the reduction process. Different amounts of PVP and NaBH 4 additions influenced the nanosolder particle size. Under varying reaction temperatures and pH values, various ranges of nanosolder size were obtained. Optimized nanosolders were studied by differential scanning calorimetry to investigate the depression of the melting temperature, and were analyzed by transmission electron microscopy to measure actual particle sizes. The dependence of the particle size on the melting temperature was observed. The melting point was depressed to 204.4°C when the average diameter of the nanosolders was 20 nm. Although SnO 2 was formed on the nanosolders, it could be cleaned by citric acid. These low-melting-temperature Sn-Ag-Cu nanosolders are candidates for use in lead-free interconnect applications.
URI: http://hdl.handle.net/10397/23184
DOI: 10.1007/s11664-011-1765-z
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