Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/22717
Title: Molecular dynamics simulation of polishing process based on coupling vibrations of liquid
Authors: Huang, Z
Guo, Z
Cheng, X
Yu, D 
Du, X 
Li, R 
Keywords: Molecular dynamics simulation
Ultra-smooth polishing
Ultrasonic vibration
Issue Date: 2006
Publisher: Springer
Source: Chinese journal of mechanical engineering, 2006, v. 19, no. 1, p. 19-24 How to cite?
Journal: Chinese journal of mechanical engineering 
Abstract: Molecular dynamics method is applied to study the machining mechanisms of polishing based on coupling vibrations of liquid. The physical phenomena of abrasive particles bombarding on silicon monocrystal surface are simulated using Tersoff potentials. The effects of vibration parameters, particle size, incident angle and particle material are analyzed and discussed. Material removal mechanisms are studied. Deformation and embedment phenomena are found in the simulations. Bombardment will destroy the crystal structures near the impact point, and adhesion effect is responsible for final removal of material.
URI: http://hdl.handle.net/10397/22717
ISSN: 1000-9345
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