Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/22436
Title: Dielectric properties of polyimide-mica hybrid films
Authors: Zhang, YH
Dang, ZM
Xin, JH 
Daoud, WA
Ji, JH
Liu, Y 
Fei, B 
Li, Y
Wu, J
Yang, S
Li, LF
Keywords: Dielectric properties
Hybrid film
Polyimide-mica
Structure
Issue Date: 2005
Publisher: Wiley-VCH
Source: Macromolecular rapid communications, 2005, v. 26, no. 18, p. 1473-1477 How to cite?
Journal: Macromolecular rapid communications 
Abstract: Polyimide-mica hybrid films were prepared via ultrasonic dispersion and in situ polymerization process from a solution of a polyimide precursor and mica in N,N-dimethylacetamide, and their structure was characterized by FTIR and XRD techniques. The dependence of dielectric properties, such as dielectric constant and electrical break-down strength, of the hybrid films on the content of mica was studied at room and cryogenic temperatures. The results show that the dielectric constant of PI-mica hybrid films decreases with the increase of the mica content at temperatures from -150 to 150°C and at frequency range from 1 kHz to 1 MHz. It was found that the cryogenic electrical breakdown strength of the PI-mica hybrid films could meet the requirements of cryogenic insulating materials.
URI: http://hdl.handle.net/10397/22436
ISSN: 1022-1336
DOI: 10.1002/marc.200500310
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