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Title: Effect of AlN content on the performance of brominated epoxy resin for printed circuit board substrate
Authors: Yung, KC 
Zhu, BL
Wu, J
Yue, TM 
Xie, CS
Keywords: AlN additives
Brominated epoxy
Coefficient of thermal expansion
Dielectric constant
Dielectric dissipation factor
Dynamic mechanical analysis
Glass-transition temperature
Halogenated resins
Tensile strength
Theoretical models
Issue Date: 2007
Publisher: John Wiley & Sons
Source: Journal of polymer science. Part B, Polymer physics, 2007, v. 45, no. 13, p. 1662-1674 How to cite?
Journal: Journal of polymer science. Part B, Polymer physics 
Abstract: Polymer matrix composites, based on brominated epoxy, a type of material widely used in printed circuit boards (PCBs), as matrix and AlN particle as filler were prepared. The influences of AlN content on the mechanical, thermal, and electrical properties of the composites were investigated by uniaxial tensile test, TMA, thermal conductivity measurement, DMA, and dielectric properties measurement. It was found that the properties of composites monotonically varied with AlN content except that maximum tensile strength and strain of composites corresponded to a filler content of 10 wt %. The results of DMA also showed the AlN reinforcement was more pronounced above Tg, and the peak area of tan δ versus T curves decreased with AlN content, which implied the damping capacity of the composite gradually decreased. The increase in Tg and decrease in damping were probably due to strong interaction between the AlN and epoxy matrix inhibiting the mobility of the epoxy chain. In addition, different theoretical models reported in the literature were used to predict the E, CTE, k, and Dk, and compared with the experimental data. Finally, suitable models were recommended in the present materials system. For the significant improvement of performance of epoxy, we can conclude that these composite materials may be promising for PCB substrate.
ISSN: 0887-6266
EISSN: 1099-0488
DOI: 10.1002/polb.21201
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