Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/22298
Title: An alternative process for electroless copper plating on polyester fabric
Authors: Guo, RH
Jiang, SQ 
Yuen, CWM
Ng, MCF 
Issue Date: 2009
Publisher: Springer
Source: Journal of materials science : materials in electronics, 2009, v. 20, no. 1, p. 33-38 How to cite?
Journal: Journal of materials science : materials in electronics 
Abstract: Electroless copper plating of polyester fabrics was demonstrated in the present investigation. The electroless Cu plating process on polyester fabric was modified by replacing the conventional PdCl 2 activator with an AgNO 3 activator to reduce the overall cost of the plating process. Both uncoated and Cu-coated polyester fabrics were characterized by the scanning electron microscope (SEM), energy dispersive spectroscopy (EDX), X-ray diffraction analysis (XRD) and X-ray photoelectron spectroscope (XPS). Relatively uniform and continuous plating was obtained under the given plating conditions. The possible mechanism of electroless copper plating of polyester fabrics utilizing an AgNO 3 activator was suggested. The electromagnetic interference (EMI) shielding effectiveness (SE) was also evaluated to study the shielding behavior of copper-plated polyester fabrics. The results demonstrated that copper-plated polyester fabrics can be applied for EMI shielding.
URI: http://hdl.handle.net/10397/22298
ISSN: 0957-4522
EISSN: 1573-482X
DOI: 10.1007/s10854-008-9594-4
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