Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/21079
Title: Copper direct drilling with tea CO2 laser in manufacture of high-density interconnection printed circuit board
Authors: Fang, XY
Yung, KC 
Keywords: CO2 laser drilling
High-density interconnection
Printed circuit board (PCB) manufacturing
Issue Date: 2006
Publisher: Institute of Electrical and Electronics Engineers
Source: IEEE transactions on electronics packaging manufacturing, 2006, v. 29, no. 3, p. 145-149 How to cite?
Journal: IEEE transactions on electronics packaging manufacturing 
Abstract: A method for copper direct drilling by carbon dioxide CO2 laser was investigated for efficient microvia formation on the copper conducting layer of high-density interconnection (HDI) of printed circuit board (PCB). A metal-tin layer was coated on the surface of copper conductor foil to enhance the CO2 laser energy adsorption on it. The coated surfaces were then drilled by a CO2 laser with various pulse energies. The microvia holes were efficiently formed in good quality with one laser pulse on 9-μm -thick polished copper conducting layer. The laser energy absorption of coated copper foils was approximately calculated. The experimental results demonstrated the potential application of the developed method in high-density interconnection printed circuit board manufacturing.
URI: http://hdl.handle.net/10397/21079
ISSN: 1521-334X
EISSN: 1558-0822
DOI: 10.1109/TEPM.2006.882868
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