Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/20565
Title: The effects of pulse plating parameters on copper plating distribution of microvia in PCB manufacture
Authors: Yung, KC 
Yue, TM 
Chan, KC 
Yeung, KF
Keywords: Microvia
Printed circuit boards
Pulse plating
Throwing power
Vibration
Issue Date: 2003
Publisher: Institute of Electrical and Electronics Engineers
Source: IEEE transactions on electronics packaging manufacturing, 2003, v. 26, no. 2, p. 106-109 How to cite?
Journal: IEEE transactions on electronics packaging manufacturing 
Abstract: The introduction of microvias to printed circuit boards has revolutionized the entire printed circuit board (PCB) industry. In many instances, the plating of microvias creates a bottleneck in the manufacture of high-density circuitry. In this study, the effects of pulse plating parameters and different shaped waveforms on the quality of microvias have been investigated. The results showed that, within the scope of this study, the reverse current cycle time has little effect on throwing power. Indeed, a decrease in forward current, or an increase in reverse current could significantly improve the throwing power. The study also found that using a triangular, instead of the traditional rectangular waveform, could increase the throwing power further, with a more uniform distribution of copper plating. Finally, the advantage of the cathode vibrating during plating was demonstrated.
URI: http://hdl.handle.net/10397/20565
ISSN: 1521-334X
EISSN: 1558-0822
DOI: 10.1109/TEPM.2003.817722
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