Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/19541
Title: Room-temperature ultrasonic bonding of semiconductor thin-dies with die attach films on glass substrates
Authors: Wong, SY
Or, SW 
Wong, HC
Cheung, YM
Choy, PK
Issue Date: 2009
Publisher: Institute of Pure and Applied Physics
Source: Japanese journal of applied physics, 2009, v. 48, no. 7 part 2, 07gm19 How to cite?
Journal: Japanese journal of applied physics 
Abstract: A novel ultrasonic bonding technique for semiconductor thin-dies laminated with die attach films (DAFs) is proposed to improve the process window and to increase the throughput limited intrinsically in the state-of-the-art thermocompression bonding technique. The proposed technique involves the introduction of ultrasonic vibration energy generated from an ultrasonic transducer to the DAFs underneath the thindies so as to adhere the thin-die-DAF laminates onto the substrates. In this paper, a 40 kHz piezoceramic ultrasonic transducer is developed and integrated with a mechatronic test bed to form an automated equipment model for the ultrasonic thin-die bonding. Process studies are conducted to bond 50 μm thick thin-dies with 10 μm thick DAFs on glass substrates using the ultrasonic and thermocompression techniques. The results show that the ultrasonic technique can effectively reduce the process temperature and time as required by the thermocompression technique. Ultrasonic bonding at room temperature (25 °C) is achieved with a process time of 2s and an ultrasonic power of 150W. Comparable bondability can only be obtained using thermocompression bonding at temperatures in excess of 120°C.
URI: http://hdl.handle.net/10397/19541
ISSN: 0021-4922
EISSN: 1347-4065
DOI: 10.1143/JJAP.48.07GM19
Appears in Collections:Journal/Magazine Article

Access
View full-text via PolyU eLinks SFX Query
Show full item record

Page view(s)

51
Last Week
0
Last month
Checked on Nov 19, 2017

Google ScholarTM

Check

Altmetric



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.