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Title: A review on the state-of-the-art microforming technologies
Authors: Fu, MW 
Chan, WL
Keywords: Deformation behavior
Micro deformation mechanism
Microforming process
Size effect
Issue Date: 2012
Publisher: Springer
Source: International journal of advanced manufacturing technology, 2012, p. 1-27 How to cite?
Journal: International journal of advanced manufacturing technology 
Abstract: Product miniaturization is an emerging trend for facilitating product usage, enabling unique product functions to be implemented in micro-scaled geometries and features, and further reducing product weight and volume. Recently, a demand for microparts increased significantly in many industry clusters. Development of the advanced micromanufacturing technologies for fabrication of such microparts has thus become a critical issue. Microforming, which offers attractive characteristics including high productivity, low cost and good quality of the formed parts, provides a promising approach to fabricating metallic microparts. In the last two decades, a lot of effort has been made to the researches on size effect related deformation behaviors in microforming process and the development of the process. Having a panorama of these researches is necessary to support micropart design and development via microforming, and further advance this micromanufacturing process. In this paper, an intensive review on the latest development of microforming technologies is presented. First of all, the paper is focused on the review of the size effect-affected deformation behaviors and the mechanisms of the changes of flow stress, flow behavior, fracture behavior, elastic recovery, tooling-workpiece interfacial friction and the surface finish of the formed parts. The state-of-the-art microforming processes, including micro deep drawing, microembossing, micropunching, microcoining, microextrusion, microheading, and micro progressive forming are then presented. Finally, some research issues from the implementation of mass production perspective are also discussed.
ISSN: 0268-3768
EISSN: 1433-3015
DOI: 10.1007/s00170-012-4661-7
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