Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/18989
Title: Application of fuzzy linear regression in modeling epoxy dispensing process
Authors: Bai, H
Kwong, CK 
Keywords: Chip-on-board packaging
Encapsulation
Fuzzy set theory
Regression analysis
Issue Date: 2004
Publisher: IEEE
Source: 2004 IEEE International Engineering Management Conference, 2004 : proceedings : 18-21 October 2004, v. 3, p. 1121-1125 How to cite?
Abstract: This paper develops a process modeling method of epoxy dispensing for microchip encapsulation based on Tanaka's fuzzy regression approach, in which the deviations between the observed values and the estimated values are expressed as the possibilities using fuzzy concept rather than statistical. In the paper, two kinds of fuzzy regression models for fill and dam processes of epoxy dispensing process, expressing the correlation between various process parameters and the two quality characteristics respectively, have been developed. Validation experiments have been performed to demonstrate the effectiveness of the process modeling method.
URI: http://hdl.handle.net/10397/18989
ISBN: 0-7803-8519-5
DOI: 10.1109/IEMC.2004.1408867
Appears in Collections:Conference Paper

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