Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/18747
Title: Effect of additions of ZrO 2 nano-particles on the microstructure and shear strength of Sn-Ag-Cu solder on Au/Ni metallized Cu pads
Authors: Gain, AK
Chan, YC
Yung, WKC 
Issue Date: 2011
Publisher: Pergamon Press
Source: Microelectronics reliability, 2011, v. 51, no. 12, p. 2306-2313 How to cite?
Journal: Microelectronics reliability 
Abstract: Nano-sized, nonreacting, noncoarsening ZrO 2 particles reinforced Sn-3.0 wt%Ag-0.5 wt%Cu composite solders were prepared by mechanically dispersing ZrO 2 nano-particles into Sn-Ag-Cu solder. The interfacial morphology of unreinforced Sn-Ag-Cu solder and solder joints containing ZrO 2 nano-particles with Au/Ni metallized Cu pads on ball grid array (BGA) substrates and the distribution of reinforcing particles were characterized metallographically. At their interfaces, a Sn-Ni-Cu intermetallic compound (IMC) layer was found in both unreinforced Sn-Ag-Cu and Sn-Ag-Cu solder joints containing ZrO 2 nano-particles and the IMC layer thickness increased with the number of reflow cycles. In the solder ball region, AuSn 4, Ag 3Sn, Cu 6Sn 5 IMC particles and ZrO 2 nano-particles were found to be uniformly distributed in the β-Sn matrix of Sn-Ag-Cu solder joints containing ZrO 2 nano-particles, which resulted in an increase in the shear strength, due to a second phase dispersion strengthening mechanism. The fracture surface of unreinforced Sn-Ag-Cu solder joints exhibited a brittle fracture mode with a smooth surface while Sn-Ag-Cu solder joints containing ZrO 2 nano-particles ductile failure characteristics with rough dimpled surfaces.
URI: http://hdl.handle.net/10397/18747
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2011.03.042
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