Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/18603
Title: Development of smart transducer with embedded sensor for automatic process control of ultrasonic wire bonding
Authors: Or, SW 
Chan, HLW 
Liu, PCK
Keywords: Lead zirconate titanate (PZT)
Piezoceramic
Ring sensor
Smart transducer
Ultrasonic wire bonder
Ultrasonic wire bonding
Automatic process control
Issue Date: 2005
Publisher: Techno Press
Source: Smart structures and systems, 2005, v. 1, no. 1, p. 47-61 How to cite?
Journal: Smart structures and systems 
Abstract: A ring-shaped lead zirconate titanate (PZT) piezoceramic sensor has been integrated with the Langevin-type piezoeeramic driver of an ultrasonic wire-bonding transducer to form a smart transducer for in-situ measurement of three essential bonding parameters: namely, impact force, ultrasonic amplitude and bond time. This sensor has an inner diameter, an outer diameter and a thickness of 12.7 mm, 5.1 mm and 0.6 mm, respectively. It has a specifically designed electrode pattern on the two major surfaces perpendicular to its thickness along which polarization is induced. The process-test results have indicated that the sensor not only is sensitive to excessive impact forces exerted on the devices to be bonded but also can track changes in the ultrasonic amplitude proficiently during bonding. Good correlation between the sensor outputs and the bond quality has been established. This smart transducer has good potential to be used in automatic process-control systems for ultrasonic wire bonding.
Description: 4th International Workshop on Structural Control, New York, Ny, 10-11 June 2004
URI: http://hdl.handle.net/10397/18603
ISSN: 1738-1584
EISSN: 1738-1991
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