Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/18049
Title: Effect of copper content on the properties of Ni-Cu-P plated polyester fabric
Authors: Guo, RH
Jiang, SQ
Yuen, CWM
Ng, MCF 
Keywords: Electroless plating
Electromagnetic interference shielding
Micro-structure
Ni-Cu-P
Polyester fabric
Surface resistance
Issue Date: 2009
Publisher: Springer
Source: Journal of applied electrochemistry, 2009, v. 39, no. 6, p. 907-912 How to cite?
Journal: Journal of Applied Electrochemistry 
Abstract: The copper content of electroless Ni-Cu-P-plated polyester fabric mainly depends on the copper ion concentration in the plating solution, which in turn has a significant effect on the properties of the coatings. The effects of copper sulphate concentration (CuSO 4) on the deposition rate, composition, surface morphology, crystal structure, surface resistance and electromagnetic interference (EMI) shielding effectiveness of electroless Ni-Cu-P deposits were investigated. The results show that the copper content in the deposits increased significantly, whereas nickel content decreased significantly and phosphorus content decreased slightly with a higher copper ion concentration. Compact coating layers were obtained with a nodular morphology. With increase of copper ion concentration in the solution, the crystallinity of the deposits also increased. In addition, the surface resistance decreased and the EMI shielding effectiveness of the Ni-Cu-P deposits increased.
URI: http://hdl.handle.net/10397/18049
DOI: 10.1007/s10800-008-9736-7
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