Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/17817
Title: Analysis of Mode II debonding behavior of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading
Authors: Gao, WY
Dai, JG 
Teng, JG 
Keywords: Bond-slip model
Concrete
Debonding
Effective bond length
Fiber reinforced polymer (FRP)
Interface
Steel
Substrate
Temperature variation
Issue Date: 2015
Publisher: Pergamon Press
Source: Engineering fracture mechanics, 2015, v. 136, p. 241-264 How to cite?
Journal: Engineering fracture mechanics 
Abstract: This paper presents a set of closed-form solutions for Mode II debonding process of fiber-reinforced polymer-to-substrate bonded joints subjected to combined thermal and mechanical loading. Six different bond-slip models are considered in deriving the closed-form solutions. For each bond-slip model, explicit expressions for the debonding load, effective bond length, interfacial shear stress, interfacial slip as well as the load-displacement response are presented. Provided the bond length is sufficiently long, the debonding load depends only on the interfacial fracture energy and the temperature variation. A temperature increase leads to an increase in both the debonding load and the effective bond length, and the rate of increase of the latter depends on the bond-slip model of the interface.
URI: http://hdl.handle.net/10397/17817
ISSN: 0013-7944
EISSN: 1873-7315
DOI: 10.1016/j.engfracmech.2015.02.002
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