Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/1764
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Electrical Engineering | - |
dc.contributor | Department of Industrial and Systems Engineering | - |
dc.creator | Cheng, KWE | - |
dc.creator | Tang, CY | - |
dc.date.accessioned | 2010-03-22T08:21:36Z | - |
dc.date.available | 2010-03-22T08:21:36Z | - |
dc.identifier.uri | http://hdl.handle.net/10397/1764 | - |
dc.language.iso | en | en_US |
dc.rights | Assignee: The Hong Kong Polytechnic University. | en_US |
dc.title | Electronic circuit board | en_US |
dc.type | Patent | en_US |
dc.description.otherinformation | Inventor name used in this publication: Ka Wai Eric Cheng | en_US |
dc.description.otherinformation | Inventor name used in this publication: Chak Yin Tang | en_US |
dc.description.otherinformation | US7675401; US7675401 B2; US7675401B2; US7,675,401; US 7,675,401 B2; 7675401; Appl. No. 11/148,444 | en_US |
dcterms.abstract | A circuit board, for an electronic circuit having a passive circuit component, has a component region, a non-component region, and circuit wiring conductors on its surface. The component region includes a polymer composition comprising a mixture of polymer resin and filler material that, in combination with the circuit wiring conductors, forms the passive circuit component. | - |
dcterms.bibliographicCitation | US Patent 7,675,401 B2. Washington, DC: US Patent and Trademark Office, 2010. | - |
dcterms.issued | 2010-03-09 | - |
dc.description.country | US | - |
dc.description.oa | Version of Record | en_US |
Appears in Collections: | Patent |
Files in This Item:
File | Description | Size | Format | |
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us7675401b2.pdf | 236.92 kB | Adobe PDF | View/Open |
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