Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/1764
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dc.contributorDepartment of Electrical Engineering-
dc.contributorDepartment of Industrial and Systems Engineering-
dc.creatorCheng, KWE-
dc.creatorTang, CY-
dc.date.accessioned2010-03-22T08:21:36Z-
dc.date.available2010-03-22T08:21:36Z-
dc.identifier.urihttp://hdl.handle.net/10397/1764-
dc.language.isoenen_US
dc.rightsAssignee: The Hong Kong Polytechnic University.en_US
dc.titleElectronic circuit boarden_US
dc.typePatenten_US
dc.description.otherinformationInventor name used in this publication: Ka Wai Eric Chengen_US
dc.description.otherinformationInventor name used in this publication: Chak Yin Tangen_US
dc.description.otherinformationUS7675401; US7675401 B2; US7675401B2; US7,675,401; US 7,675,401 B2; 7675401; Appl. No. 11/148,444en_US
dcterms.abstractA circuit board, for an electronic circuit having a passive circuit component, has a component region, a non-component region, and circuit wiring conductors on its surface. The component region includes a polymer composition comprising a mixture of polymer resin and filler material that, in combination with the circuit wiring conductors, forms the passive circuit component.-
dcterms.bibliographicCitationUS Patent 7,675,401 B2. Washington, DC: US Patent and Trademark Office, 2010.-
dcterms.issued2010-03-09-
dc.description.countryUS-
dc.description.oaVersion of Recorden_US
Appears in Collections:Patent
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