Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/17332
Title: Enhancement of the machinability of silicon by hydrogen ion implantation for ultra-precision micro-cutting
Authors: To, S 
Wang, H
Jelenkovic, EV
Keywords: Brittle-to-ductile transition
Hydrogen ion implantation
Machinability
Silicon
Ultra-precision micro-cutting
Issue Date: 2013
Publisher: Elsevier
Source: International journal of machine tools and manufacture, 2013, v. 74, p. 50-55 How to cite?
Journal: International journal of machine tools and manufacture 
Abstract: This paper presents the implementation method of surface modification by hydrogen ion implantation in silicon on the enhancement of machinability of silicon by facilitating the brittle-to-ductile transition. The distribution of the implanted hydrogen ions and induced displacements in the sub-surface of silicon wafer is visualised through modelling. The micro-cutting experiments are conducted on ultra-precision raster milling to verify the enhancement effect on the machinability of silicon.
URI: http://hdl.handle.net/10397/17332
ISSN: 0890-6955
EISSN: 0890-6955
DOI: 10.1016/j.ijmachtools.2013.07.005
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