Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/16644
Title: Transfer imprint lithography using a soft mold
Authors: Xin, JZ
Lee, FK
Li, SYW
Chan, KS
Chan, HLW 
Leung, CW 
Keywords: Imprinting
Metal pattern transfer
PDMS
Soft mold
Issue Date: 2011
Publisher: Elsevier
Source: Microelectronic engineering, 2011, v. 88, no. 8, p. 2632-2635 How to cite?
Journal: Microelectronic engineering 
Abstract: In order to simplify the nanoimprint process and allow thick metal sacrificial layer deposition for high-aspect-ratio etching, a transfer imprint lithography technique is introduced. A metal layer is deposited on PDMS mold, and it is subsequently imprinted against an uncured nanoimprint resist layer spin coated on the substrate. The curing of nanoimprint resist by UV exposure naturally provides adhesion between the metal and substrate. The use of soft PDMS mold generates conformal contact of patterns with target surfaces and greatly reduces the imprinting pressure required for homogenous mask transfer.
URI: http://hdl.handle.net/10397/16644
ISSN: 0167-9317
EISSN: 1873-5568
DOI: 10.1016/j.mee.2011.01.062
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