Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/16310
Title: Modeling of electrocrystallization for pulse current electroforming of nickel
Authors: Wong, KP
Chan, KC 
Yue, TM 
Keywords: Shaped waveform
Electrocrystallization
Pulse current electroforming
Simulation
Deposit quality
Issue Date: 2001
Publisher: North-Holland
Source: Applied surface science, 2001, v. 178, no. 1-4, p. 178-189 How to cite?
Journal: Applied surface science 
Abstract: A mathematical model has been established for formulating the effect of different types of waveform on the three-dimensional electrocrystallization of nickel electroforms. The model describes how the different types of waveform influence the rate of three-dimensional nucleation, J, the rate of three-dimensional step growth via surface diffusion path, JSD, and the rate of three-dimensional step growth via direct transfer path, JDT, at the cathodic surface. Moreover, the dynamic electrocrystallization process including J, JSD and JDT was simulated. The highest maximum nucleation rate was obtained when a ramp-down waveform was employed. The highest step growth rate either via surface diffusion path or direct transfer path was obtained when conventional rectangular waveform was used. The best quality of electroforms, in terms of fine-grained structure, was found when a ramp-down waveform was employed. These results are in agreement with the findings of our previous studies.
URI: http://hdl.handle.net/10397/16310
ISSN: 0169-4332
EISSN: 1873-5584
DOI: 10.1016/S0169-4332(01)00317-8
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