Please use this identifier to cite or link to this item:
http://hdl.handle.net/10397/1629
DC Field | Value | Language |
---|---|---|
dc.contributor | Department of Electrical Engineering | - |
dc.creator | Wu, WT | - |
dc.creator | Wong, YW | - |
dc.creator | Cheng, KWE | - |
dc.date.accessioned | 2014-12-11T08:26:36Z | - |
dc.date.available | 2014-12-11T08:26:36Z | - |
dc.identifier.isbn | 9623675445 | - |
dc.identifier.uri | http://hdl.handle.net/10397/1629 | - |
dc.language.iso | en | en_US |
dc.publisher | Power Electronics Research Centre, The Hong Kong Polytechnic University | en_US |
dc.rights | Copyright © The Hong Kong Polytechnic University 2006 | en_US |
dc.subject | Magnetic material | en_US |
dc.subject | Magnetic property | en_US |
dc.subject | Polymer bonded | en_US |
dc.subject | Temperature | en_US |
dc.title | Temperature dependence of magnetic properties of a polymer bonded magnetic material | en_US |
dc.type | Conference Paper | en_US |
dc.description.otherinformation | Author name used in this publication: Y. W. Wong | en_US |
dc.description.otherinformation | Refereed conference paper | en_US |
dcterms.abstract | Polymer bonded magnetic materials have recently attracted increasing attention from fundamental research to industrial applications in many electromagnetic devices. It is necessary to investigate the properties of these magnetic materials operated under different environmental conditions. In particular, in this work, we investigated the relationship between the temperature and the magnetic properties of a polymer bonded magnetic material, epoxy (EP) resin bonded Co-Ni magnetic material. Experimental results indicate that the coercivity, the remanence magnetic flux density and the saturation magnetic flux density decrease at the elevated temperature. It is envisioned that the present studies may offer guidance for the applications of the polymer bonded magnetic material. | - |
dcterms.accessRights | open access | en_US |
dcterms.bibliographicCitation | 2006 2nd International Conference on Power Electronics Systems and Applications : Hong Kong, 12-14 November 2006, p. 73-76 | - |
dcterms.issued | 2006 | - |
dc.identifier.isi | WOS:000246341500015 | - |
dc.identifier.scopus | 2-s2.0-50249120076 | - |
dc.relation.ispartofbook | 2006 2nd International Conference on Power Electronics Systems and Applications : Hong Kong, 12-14 November 2006 | - |
dc.identifier.rosgroupid | r31299 | - |
dc.description.ros | 2006-2007 > Academic research: refereed > Refereed conference paper | - |
dc.description.oa | Version of Record | en_US |
dc.identifier.FolderNumber | OA_IR/PIRA | en_US |
dc.description.pubStatus | Published | en_US |
Appears in Collections: | Conference Paper |
Files in This Item:
File | Description | Size | Format | |
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ICPESA_2006_73-76.pdf | 1.39 MB | Adobe PDF | View/Open |
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