Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/16185
Title: The process modelling of epoxy dispensing for microchip encapsulation using fuzzy linear regression with fuzzy intervals
Authors: Ip, CKW
Kwong, CK 
Bai, H
Tsim, YC
Keywords: Epoxy dispensing
Fuzzy linear regression
Microchip encapsulation
Process modelling
Issue Date: 2003
Publisher: Springer
Source: International journal of advanced manufacturing technology, 2003, v. 22, no. 5-6, p. 417-423 How to cite?
Journal: International journal of advanced manufacturing technology 
Abstract: Epoxy dispensing is a popular way to perform microchip encapsulation for chip-on-board (COB) packages. However, the determination of the proper process parameters setting for a satisfactory encapsulation quality is difficult due to the complex behaviour of the encapsulant during the dispensing process and the inherent fuzziness of epoxy dispensing systems. Sometimes, the observed values from the process may be irregular. In conventional regression models, deviations between the observed values and the estimated values are supposed to have a probability distribution. However, when data is scattered, the obtained regression model has too wide of a possibility range. These deviations in processes such as epoxy dispensing can be regarded as system fuzziness that can be dealt with satisfactorily using a fuzzy regression method. In this paper, the fuzzy linear regression concept with fuzzy intervals and its application to the process modelling of epoxy dispensing for microchip encapsulation are described. Two fuzzy regression models, expressing the correlation between various process parameters and the two quality characteristics, respectively, were developed. Validation experiments were performed to demonstrate the effectiveness of the method for process modelling.
URI: http://hdl.handle.net/10397/16185
ISSN: 0268-3768
EISSN: 1433-3015
DOI: 10.1007/s00170-002-1517-6
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