Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/15847
Title: Deposition behaviour and morphology of Ni-SiC electro-composites under triangular waveform
Authors: Hu, F
Chan, KC 
Keywords: Electrodeposition
Equivalent circuit model
Morphology
Ni-SiC
Triangular waveform
Issue Date: 2005
Publisher: North-Holland
Source: Applied surface science, 2005, v. 243, no. 1-4, p. 251-258 How to cite?
Journal: Applied surface science 
Abstract: The deposition behaviour and morphology of Ni-SiC electro-composites were investigated under a triangular waveform. It was found that the grain size of the Ni-SiC composites decreased with increasing average current density, and the hardness of the composites increased with decreasing nickel matrix grain size. An equivalent circuit model based on the results of electrochemical impedance spectroscopy was formulated to simulate the charge transfer process under triangular waveform. Compared with deposits produced under the direct current, the triangular waveform with relaxation time provided a higher instantaneous peak current for charge transfer, which resulted in an improvement in morphology and hardness of the composites. The mathematical model was found to be in agreement with the experimental results.
URI: http://hdl.handle.net/10397/15847
ISSN: 0169-4332
EISSN: 1873-5584
DOI: 10.1016/j.apsusc.2004.09.068
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