Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/15380
Title: Selective laser processing of ink-jet printed nano-scaled tin-clad copper particles
Authors: Yung, KC 
Plura, TS
Issue Date: 2010
Publisher: Springer
Source: Applied physics. A, Materials science & processing, 2010, v. 101, no. 2, p. 393-397 How to cite?
Journal: Applied physics. A, Materials science & processing 
Abstract: The deposition of tin-clad nano-size copper particles was carried out by means of ink-jet printing. Curing the particles on Polyimide (PI) turned them into soldered structures using an Nd-YAG laser. Area coverage of 55% was achieved for a single-layer print. Subsequent laser sintering increased this value to 95%. A Butanol-based copper ink and an aqueous tin (Sn)-clad Copper (Cu) ink were produced and were ink-jetted in this work. These nano-metallic inks showed excellent suspension stability with particle weight concentrations as high as 5%. The ink components were examined by measuring the particle size distribution in a dispersed condition, and the melting temperature. A piezo ink-jet print head was used to deposit the inks onto a moveable substrate. The thermal effect of the laser irradiation allowed approaching and connecting adjacent particles by melting the particle's tin coating. The results were examined with regard to structure and soldering properties using EDX, SEM and optical microscopy.
URI: http://hdl.handle.net/10397/15380
ISSN: 0947-8396
EISSN: 1432-0630
DOI: 10.1007/s00339-010-5867-x
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