Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/15181
Title: The mechanical properties and resistivity of Au/NiCr/Ta multi-layered films on Si-(111) substrate
Authors: Tang, W
Xu, K
Lu, J
Keywords: Au/NiCr/Ta films
Hardness
Residual stress
Resistivity
Issue Date: 2011
Publisher: Elsevier
Source: Thin solid films, 2011, v. 520, no. 2, p. 824-827 How to cite?
Journal: Thin solid films 
Abstract: Au/NiCr/Ta multi-layered metallic films were deposited on Si substrate by magnetron sputtering at different substrate temperatures. The residual stress, hardness and resistivity were investigated as a function of substrate temperature by laser polarization phase shift technique, nanoindentation technique and four point probe method, respectively. The residual stress in as-deposited films at different substrate temperatures was tension with 385 MPa-606 MPa. Nanoindentation tests at shallow indentation depths (h ≤ t/4) where the hardness is reliable for metal films on hard substrate. Au film at deposition temperature 200 °C has the highest hardness 4.2 GPa. The resistivity in the deposited films reached the lowest value 3.1 μΩ.cm at substrate temperature 200 °C. The most interesting facts are that the hardness decreases with increasing residual stress and resistivity increases with increasing residual stress. The relationship of residual stress and resistivity may hint that there is a definite correlation between the mechanical properties and electrical properties in the metallic films.
URI: http://hdl.handle.net/10397/15181
ISSN: 0040-6090
EISSN: 1879-2731
DOI: 10.1016/j.tsf.2011.01.348
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