Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/14753
Title: Laser bending of leadframe materials
Authors: Yau, CL
Chan, KC 
Lee, WB 
Keywords: Integrated circuit leadframes
Laser bending
Steel alloy
Issue Date: 1998
Publisher: Elsevier
Source: Journal of materials processing technology, 1998, v. 82, no. 1-3, p. 117-121 How to cite?
Journal: Journal of materials processing technology 
Abstract: Over the last decade, there have been numerous research works conducted on laser bending. However, less research effort has been spent on investigating the laser bending of thin sheets using a low power laser. In the present study, a low power Nd:YAG laser is used to experimentally examine the bending behaviour of a thin steel alloy strip which is now being used for integrated circuit leadframes. In the experiments, a machine vision system has been used to measure bending angles in a more accurate and efficient way. The experimental results show that the final bending angle in a multiple-irradiation laser bending process is related strongly to the laser power, the processing velocity, the number of irradiations and the holding time between each laser irradiation. A threshold line energy of about 0.14 J mm-1 is observed, and a linear relationship between the bending angle and the line energy is found when the latter is below 1 J mm-1.
URI: http://hdl.handle.net/10397/14753
ISSN: 0924-0136
EISSN: 1873-4774
DOI: 10.1016/S0924-0136(98)00012-0
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