Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/14656
Title: In-house development of low cost automatic IC workcell for BGA solder ball attachment
Authors: Tam, KFD
Chan, CY 
Ip, WH 
Tang, CSJ
Keywords: Flipchips
Integrated circuit technology
Solder
Substrates
Issue Date: 2008
Publisher: Emerald Group Publishing Limited
Source: Assembly automation, 2008, v. 28, no. 3, p. 255-261 How to cite?
Journal: Assembly Automation 
URI: http://hdl.handle.net/10397/14656
DOI: 10.1108/01445150810889510
Appears in Collections:Journal/Magazine Article

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