Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/14567
Title: Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-Zn-3Bi solders in Au/Ni/Cu ball grid array packages
Authors: Gain, AK
Chan, YC
Yung, WKC 
Keywords: Ball grid array solder joints
Microstructure
Nano doping
Shearing force
Issue Date: 2009
Publisher: Elsevier
Source: Materials science and engineering. B, Solid-state materials for advanced technology, 2009, v. 162, no. 2, p. 92-98 How to cite?
Journal: Materials science and engineering. B, Solid-state materials for advanced technology 
Abstract: The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear loads with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After the addition of nano Ni powder in Sn-based lead-free solders, there were no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn-rich phase was observed. Also on the fracture surfaces a fine Zn-Ni compound was found. After the addition of nano Ni powder in Sn-based solders, the shear loads were increased due to a refinement of the microstructure and in addition, ductile fracture surfaces were clearly observed. The shear loads of the plain Sn-9Zn and Sn-8Zn-3Bi solders after one reflow cycle were about 1798 g and 2059 g, respectively. After the addition of nano Ni powder, their loads were about 2172 g and 2212 g, respectively, after one reflow cycle and their shear loads after eight reflow cycles were about 2099 g and 2081 g, respectively.
URI: http://hdl.handle.net/10397/14567
ISSN: 0921-5107
DOI: 10.1016/j.mseb.2009.03.010
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