Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/14440
Title: Formation and mechanism of superhydrophobic/hydrophobic surfaces made from amphiphiles through droplet-mediated evaporation-induced self-assembly
Authors: Dong, F
Zhang, M
Tang, WW
Wang, Y 
Issue Date: 2015
Publisher: American Chemical Society
Source: Journal of physical chemistry B, 2015, v. 119, no. 16, p. 5321-5327 How to cite?
Journal: Journal of Physical Chemistry B 
Abstract: Superhydrophobic/hydrophobic surfaces have attracted wide attention because of their broad applications in various regions, including coating, textile, packaging, electronic devices, and bioengineering. Many studies have been focused on the fabrication of superhydrophobic/hydrophobic surfaces using natural materials. In this paper, superhydrophobic/hydrophobic surfaces were formed by an amphiphilic natural protein, zein, using electrospinning. Water contact angle (WCA) and scanning electron microscopy (SEM) were used to characterize the hydrophobicity and surface morphology of the electrospun structures. The highest WCA of the zein electrospun surfaces could reach 155.5 ¡Ó 1.4¢X. To further understand the mechanism of superhydrophobic surface formation from amphiphiles using electrospinning, a synthetic amphiphilic polymer was selected, and also, a method similar to electrospinning, spray drying, was tried. The electrospun amphiphilic polymer surface showed a high hydrophobicity with a WCA of 141.4 ¡Ó 0.7¢X. WCA of the spray-dried zein surface could reach 125.3 ¡Ó 2.1¢X. The secondary structures of the zein in the electrospun film and cast-dried film were studied using ATR-FTIR, showing that £\-helix to £]-sheet transformation happened during the solvent evaporation in the cast drying process but not in the electrospinning process. A formation mechanism was proposed on the basis of the orientation of the amphiphiles during the solvent evaporation of different fabrication methods. The droplet-based or jet-based evaporation during electrospinning a
URI: http://hdl.handle.net/10397/14440
ISSN: 1520-6106
DOI: 10.1021/acs.jpcb.5b00011
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