Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/13616
Title: Correlating interconnect stress test and accelerated thermal cycling for accessing the reliabilities of high performance printed circuit boards
Authors: Yung, WKC 
Liem, HM
Choy, HHS
Man, YW
Keywords: Accelerated thermal cycling
cycle to failure
interconnect stress test
plated through hole
printed circuit board
Issue Date: 2011
Publisher: Institute of Electrical and Electronics Engineers
Source: IEEE transactions on components, packaging and manufacturing technology, 2011, v. 1, no. 12, 6119132, p. 2005-2017 How to cite?
Journal: IEEE transactions on components, packaging and manufacturing technology 
Abstract: Understanding the failure mechanism of a plated through hole (PTH) is essential for a complete picture of their life span, and hence for the continued electronic reliability prediction and development of high performance printed circuit boards. This paper presents the efficacy of establishing a correlation between interconnect stress test (IST) and accelerated thermal cycling (ATC) data on standard high performance coupons. In accord with the observation in PTH micro-sectioning, a PTH failure mechanism is proposed based on the thermal expansion-induced shearing at the copper-resin interface. The PTH cycle to failure data from the two methodologies, IST and ATC, are correlated. In terms of the glass transition temperature, a linear relationship exists between two different data sets. It is also demonstrated that the base material thermal property and PTH sizes are the two essential factors determining the reliability of a PTH. Furthermore, a life stress model is created to predict the life time of a coupon at a particular temperature level.
URI: http://hdl.handle.net/10397/13616
ISSN: 2156-3950 (print)
2156-3985 (online)
DOI: 10.1109/TCPMT.2011.2167323
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