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|Source:||US Patent 6,190,497 B1. Washington, DC: US Patent and Trademark Office, 2001. How to cite?|
|Abstract:||A bonding tool for applying pressure and ultrasonic energy simultaneously to join miniature components together includes an ultrasonic driver having four composite wafers separated by electrodes. Such bonding tools are known that use wafers made of wholly of ceramic material. By using wafers having four sector parts of ceramic material separated by layers of polymer as shown, bonding tools are provided with broader bandwidth operation and reduced spurious resonance modes.|
|Rights:||Assignee: The Hong Kong Polytechnic University.|
|Appears in Collections:||Patent|
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