Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/13244
Title: Low temperature superplastic gas pressure forming of electrodeposited Ni/SiCp nanocomposites
Authors: Chan, KC 
Wang, GF
Wang, CL
Zhang, KF
Keywords: Bulging
Electrodeposition
Finite element method
Nanocomposites
Superplasticity
Issue Date: 2005
Source: Materials science and engineering a, 2005, v. 404, no. 1-2, p. 108-116 How to cite?
Journal: Materials Science and Engineering A 
Abstract: The superplastic deformation behavior of a Ni/SiCp nanocomposite was investigated under equibiaxial tension at a strain rate of 8.3 × 10-4 s-1 and various forming temperatures and die apertures. The average as-deposited nickel grain size was 40 nm, and the average SiC particle size was 50 nm. The experimental relative bulging height (RBH) values were measured, and compared with that predicted by a finite element method (FEM) model. It was found that the composite had exhibited good superplasticity, illustrating high RBH values, and the die diameter affected significantly its deformation behavior. The cavitation behavior of the composite was also examined, and found to be dependent on stress state and the total effective strain. As compared to the analytical results, the FEM predictions were shown to be in better agreement with the experimental thickness distribution, although a large discrepancy was observed for dies with small diameters.
URI: http://hdl.handle.net/10397/13244
ISSN: 0921-5093
DOI: 10.1016/j.msea.2005.05.042
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