Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/12793
Title: Optimization of process conditions for the transfer molding of electronic packages
Authors: Tong, KW
Kwong, CK 
Ip, KW
Keywords: Electronic packages
Process condition
Process simulation
Taguchi method
TOPSIS
Transfer molding
Issue Date: 2003
Publisher: Elsevier
Source: Journal of materials processing technology, 2003, v. 138, no. 1-3, p. 361-365 How to cite?
Journal: Journal of materials processing technology 
Abstract: Transfer molding is used extensively in electronic packaging. To achieve a high production rate and high molding quality, it is necessary to have strict control on the epoxy resin characteristics as well as identify the optimal process conditions of the transfer molding. In this paper, process simulations of transfer molding for electronic packages were conducted according to Taguchi experiments. The simulation results were then used to derive quality indexes by using TOPSIS (techniques for order preference by similarity of ideal solution) algorithm. Through the analysis of the quality indexes, optimal process conditions can be identified. Two verification tests were carried out and results of the tests are found very close to the predictions. This project has demonstrated that numerical simulation combining with Taguchi method and TOPSIS can be a useful tool for optimization of process conditions for transfer molding of electronic packages.
URI: http://hdl.handle.net/10397/12793
ISSN: 0924-0136
EISSN: 1873-4774
DOI: 10.1016/S0924-0136(03)00099-2
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