Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/12206
Title: Copper sludge from printed circuit board production/recycling for ceramic materials : a quantitative analysis of copper transformation and immobilization
Authors: Tang, Y
Lee, PH 
Shih, K
Issue Date: 2013
Publisher: American Chemical Society
Source: Environmental science & technology, 2013, v. 47, no. 15, p. 8609-8615 How to cite?
Journal: Environmental science & technology 
Abstract: The fast development of electronic industries and stringent requirement of recycling waste electronics have produced a large amount of metal-containing waste sludge. This study developed a waste-to-resource strategy to beneficially use such metal-containing sludge from the production and recycling processes of printed circuit board (PCBs). To observe the metal incorporation mechanisms and phase transformation processes, mixtures of copper industrial waste sludge and kaolinite-based materials (kaolinite and mullite) were fired between 650 and 1250 C for 3 h. The different copper-hosting phases were identified by powder X-ray diffraction (XRD) in the sintered products, and CuAl2O 4 was found to be the predominant hosting phase throughout the reactions, regardless of the strong reduction potential of copper expected at high temperatures. The experimental results indicated that CuAl 2O4 was generated more easily and in larger quantities at low-temperature processing when using the kaolinite precursor. Maximum copper transformations reached 86% and 97% for kaolinite and mullite systems, respectively, when sintering at 1000 C. To monitor the stabilization effect after thermal process, prolonged leaching tests were carried out using acetic acid with an initial pH value of 2.9 to leach the sintered products for 20 days. The results demonstrated the decrease of copper leachability with the formation of CuAl2O4, despite different sintering behavior in kaolinite and mullite systems. This study clearly indicates spinel formation as the most crucial metal stabilization mechanism when sintering copper sludge with aluminosilicate materials, and suggests a promising and reliable technique for reusing metal-containing sludge as ceramic materials.
URI: http://hdl.handle.net/10397/12206
ISSN: 0013-936X
EISSN: 1520-5851
DOI: 10.1021/es400404x
Appears in Collections:Journal/Magazine Article

Access
View full-text via PolyU eLinks SFX Query
Show full item record

SCOPUSTM   
Citations

8
Last Week
0
Last month
0
Citations as of Aug 12, 2017

WEB OF SCIENCETM
Citations

8
Last Week
0
Last month
1
Citations as of Aug 4, 2017

Page view(s)

88
Last Week
1
Last month
Checked on Aug 13, 2017

Google ScholarTM

Check

Altmetric



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.