Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/12107
Title: Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing
Authors: Yung, KC 
Liem, H
Keywords: Boron nitride
Composite
Epoxy
Thermal conductivity
Thermogram
Issue Date: 2007
Publisher: John Wiley & Sons
Source: Journal of applied polymer science, 2007, v. 106, no. 6, p. 3587-3591 How to cite?
Journal: Journal of applied polymer science 
Abstract: Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (hBN) and cubic boron nitride (cBN) as fillers. The thermal conductivity of boron nitride filled epoxy matrix composites was enhanced up to 217% through silane surface treatment of fillers and multi-modal particle size mixing (two different hBN particle sizes and one cBN particle size) prior to fabricating the composite. The measurements and interpretation of the curing kinetics of anhydride cured epoxies as continuous matrix, loaded with BN having multi-modal particle size distribution, as heat conductive fillers, are highlighted. This study evidences the importance of surface engineering and multi-modal mixing distribution applied in inorganic fillered epoxy-matrix composite.
URI: http://hdl.handle.net/10397/12107
ISSN: 0021-8995
EISSN: 1097-4628
DOI: 10.1002/app.27027
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