Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/11352
Title: Microstructure evolution of copper strips with gradient temperature in electropulsing treatment
Authors: Zhu, RF
Tang, GY
Shi, SQ 
Fu, MW 
Keywords: Crystallization
Electropulsing treatment
Gradient temperature
Microstructure evolution
Nucleation
Issue Date: 2013
Publisher: Elsevier
Source: Journal of alloys and compounds, 2013, v. 581, p. 160-165 How to cite?
Journal: Journal of alloys and compounds 
Abstract: Microstructure evolution of copper strips with gradient temperature between two electrodes in electropulsing treatment is investigated. The cold-rolled copper strips develop recovery and recrystallization between the two electrodes. The gradient temperature caused by the movement of strips in the treatment process results in the evolution of microstructure. The larger temperature gradient distribution caused by the electropulsing treatment with higher frequency, the larger microstructure evolution the copper strips have, indicating the temperature plays an important role in electropulsing treatment.
URI: http://hdl.handle.net/10397/11352
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2013.07.017
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