Please use this identifier to cite or link to this item: http://hdl.handle.net/10397/10804
Title: Surface characterization of pre-treated copper foil used for PCB lamination
Authors: Yung, KC 
Wang, J
Yue, TM 
Keywords: Copper
Lamination
PCB
Roughness
Surface treatment
Issue Date: 2007
Publisher: Brill Academic Publishers
Source: Journal of adhesion science and technology, 2007, v. 21, no. 5-6, p. 363-377 How to cite?
Journal: Journal of Adhesion Science and Technology 
Abstract: Properly micro-roughened electrodeposited copper foil is used in the conventional lamination process in order to improve its bond strength. In this investigation other treatments, including pumice scrubbing, chemical etching and brush scrubbing methods, were employed in order to obtain strong bonding. The effects of these treatments are investigated in terms of copper surface morphology using optical profilometry (OP), scanning electron microscopy (SEM) and atomic force microscopy (AFM). The microstructure of the electrodeposited copper foil surface and its bonding properties are discussed in terms of various experimental results, in order to compare it with rolled annealed copper foil. Various surface morphologies of copper foil corresponding to different treatments are observed. The pumice scrubbing showed the largest increase in copper surface roughness, which leads to the highest improvement in bonding properties. The bond strength between copper and FR-4 resin substrate was analyzed by peel strength measurements, and based on this, the optimized process to treat the copper surface is proposed.
URI: http://hdl.handle.net/10397/10804
DOI: 10.1163/156856107780474939
Appears in Collections:Journal/Magazine Article

Access
View full-text via PolyU eLinks SFX Query
Show full item record

Page view(s)

35
Last Week
5
Last month
Checked on Aug 21, 2017

Google ScholarTM

Check

Altmetric



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.